TEL Tokyo Electron 3D81-000040-V2處理器模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron 3D81-000040-V2 處理器模塊
產(chǎn)品類型：控制處理模塊 / Processor Board
制造商：Tokyo Electron Ltd.（TEL）
一、產(chǎn)品功能簡介
該模塊是用于 TEL 半導(dǎo)體設(shè)備中的 嵌入式控制核心部件，承擔(dān)設(shè)備運(yùn)行中的數(shù)據(jù)處理、邏輯控制與系統(tǒng)協(xié)調(diào)等關(guān)鍵功能。其主要職責(zé)包括：
管理和控制設(shè)備的運(yùn)行邏輯、動作流程
實時采集傳感器數(shù)據(jù)并做出邏輯判斷
啟動、停止和調(diào)度設(shè)備子模塊（如加熱器、閥門、真空泵、機(jī)械臂等）
作為主控CPU板或嵌入式系統(tǒng)核心，運(yùn)行嵌入式操作系統(tǒng)或定制固件
支持與HMI（人機(jī)界面）或遠(yuǎn)程監(jiān)控系統(tǒng)的數(shù)據(jù)通信
二、典型應(yīng)用領(lǐng)域
1. 晶圓刻蝕設(shè)備（Etching Systems）
控制真空腔內(nèi)的等離子體生成、電源調(diào)節(jié)、刻蝕時間與氣體流量等
實現(xiàn)工藝參數(shù)的精準(zhǔn)控制與反饋調(diào)整
2. 化學(xué)氣相沉積系統(tǒng)（CVD / ALD）
管理沉積溫度、氣體比例、反應(yīng)時間等關(guān)鍵變量
確保沉積厚度和均勻性滿足工藝要求
3. 晶圓傳輸模塊（Wafer Handling Systems）
控制機(jī)械手、軌道、電梯、Loadlock門等動作
實現(xiàn)高效、高精度的晶圓搬運(yùn)與對接
4. 光刻與清洗設(shè)備
在光刻設(shè)備中負(fù)責(zé)光源控制、曝光對準(zhǔn)、調(diào)焦等動作控制
在清洗系統(tǒng)中控制噴頭、流體壓力、電機(jī)運(yùn)轉(zhuǎn)等執(zhí)行單元
英文資料：
TEL Tokyo Electron 3D81-000040-V2 processor module
Product Type: Control Processing Module/Processor Board
Manufacturer: Tokyo Electron Ltd. (TEL)
1、 Product Function Introduction
This module is an embedded control core component used in TEL semiconductor equipment, responsible for key functions such as data processing, logic control, and system coordination during equipment operation. Its main responsibilities include:
Manage and control the operational logic and action flow of equipment
Real time collection of sensor data and making logical judgments
Start, stop, and schedule equipment submodules (such as heaters, valves, vacuum pumps, robotic arms, etc.)
As the main control CPU board or embedded system core, running embedded operating systems or customized firmware
Support data communication with HMI (Human Machine Interface) or remote monitoring system
2、 Typical application areas
1. Etching Systems for wafer etching equipment
Control plasma generation, power regulation, etching time, and gas flow rate inside the vacuum chamber
Realize precise control and feedback adjustment of process parameters
2. Chemical vapor deposition system (CVD/ALD)
Manage key variables such as sedimentation temperature, gas ratio, reaction time, etc
Ensure that the sedimentation thickness and uniformity meet the process requirements
3. Wafer Handling Systems
Control the actions of robotic arms, tracks, elevators, Loadlock doors, etc
Realize efficient and high-precision wafer handling and docking
4. Lithography and cleaning equipment
Responsible for controlling actions such as light source control, exposure alignment, and focusing in lithography equipment
Control the execution units such as nozzles, fluid pressure, and motor operation in the cleaning system
2.產(chǎn) 品 展 示
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| 745-W2-P1-G1-HI-T-H | 8030-PS-41 | X-FTA 005 02L |
| 745-W2-P15-G1-LO-A-R | 8030-RIM-331 | X-FTA 003 02L 02R |
| 735-5-5-LO-485 | 8030-RIM-25 | X-FTA 002 02L 02R |
| 735-5-5-HI-485 | 8030-RIM-144 | X-FTA 002 01L 01R |
| 735-5-5-125-485-DEMO | 8030-RIM-143 | X-FTA 001 02L |
| 735-5-1-LO-485 | 8030-RIM-141 | X-FTA 001 01L |
| 735-5-1-HI-485 | 8030-ROM-141 | X-MIO 7/6 01 |
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