TEL Tokyo Electron 808-520170-3印刷電路板 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
TEL Tokyo Electron 808-520170-3 印刷電路板
類型:PCB 控制板 / Interface or Logic Circuit Board
制造商:Tokyo Electron Ltd.(TEL)
一、產(chǎn)品功能概述
該電路板是 TEL 半導(dǎo)體制造設(shè)備中的一個(gè)核心電子模塊,通常用于以下目的:
作為 信號(hào)處理、邏輯控制或電源調(diào)節(jié)電路的承載平臺(tái)
實(shí)現(xiàn)控制系統(tǒng)與執(zhí)行單元之間的通信與數(shù)據(jù)交換
對(duì)輸入/輸出信號(hào)進(jìn)行邏輯判斷、緩沖、隔離或?yàn)V波
支持外部傳感器、執(zhí)行器或其他板卡之間的連接和協(xié)調(diào)控制
二、典型應(yīng)用領(lǐng)域
1. 半導(dǎo)體刻蝕設(shè)備(Etching Systems)
控制等離子體發(fā)生器、真空腔體閥門、電源狀態(tài)等
作為刻蝕系統(tǒng)的信號(hào)中轉(zhuǎn)與判斷邏輯核心
2. 薄膜沉積設(shè)備(CVD / ALD / PVD)
用于控制氣體比例閥、加熱器、壓力傳感器等關(guān)鍵組件
實(shí)現(xiàn)對(duì)溫度、流量、壓強(qiáng)的動(dòng)態(tài)調(diào)節(jié)
3. 晶圓傳輸與裝載系統(tǒng)(Wafer Handling)
控制搬運(yùn)機(jī)械手、電機(jī)驅(qū)動(dòng)、傳感器反饋等
確保晶圓在工藝腔體之間準(zhǔn)確、安全地轉(zhuǎn)移
4. 系統(tǒng)主控單元中的輔助子板
為主CPU板、通信板等提供信號(hào)轉(zhuǎn)換與接口橋接
支持?jǐn)?shù)字量與模擬量輸入/輸出
5. 清洗與烘干系統(tǒng)(Wet Bench / Scrubber)
控制噴嘴、加熱器、流量泵等運(yùn)行邏輯
實(shí)現(xiàn)流程控制自動(dòng)化
英文資料:
TEL Tokyo Electron 808-52170-3 Printed Circuit Board
Type: PCB Control Board/Interface or Logic Circuit Board
Manufacturer: Tokyo Electron Ltd. (TEL)
1、 Product Function Overview
This circuit board is a core electronic module in TEL semiconductor manufacturing equipment, typically used for the following purposes:
As a carrier platform for signal processing, logic control, or power regulation circuits
Implement communication and data exchange between the control system and the execution unit
Logical judgment, buffering, isolation, or filtering of input/output signals
Support connection and coordinated control between external sensors, actuators, or other boards
2、 Typical application areas
1. Semiconductor Etching Systems
Control the plasma generator, vacuum chamber valves, power status, etc
As the signal relay and judgment logic core of the etching system
2. Thin film deposition equipment (CVD/ALD/PVD)
Used to control key components such as gas proportional valves, heaters, pressure sensors, etc
Realize dynamic adjustment of temperature, flow rate, and pressure
3. Wafer Handling System
Control the handling robot arm, motor drive, sensor feedback, etc
Ensure accurate and safe transfer of wafers between process chambers
4. Auxiliary daughter board in the main control unit of the system
Provide signal conversion and interface bridging for main CPU board, communication board, etc
Support digital and analog input/output
5. Cleaning and Drying System (Wet Bench/Scrubber)
Control the operating logic of nozzles, heaters, flow pumps, etc
Realize process control automation
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
1TGE120011R1001 機(jī)器人驅(qū)動(dòng)電源模塊
4.其他英文產(chǎn)品
ASEA 57360001-HG Circuit Board
AMAT 0190-66253 Communication Module
710-805314-00 | 8020-SCP-423 | X-DO 32 51 |
710-805000-50 | 8020-SCP-401 | X-DO 32 01 |
710-800667 | 8020-SCP-333 | X-CI 24 51 |
710-774063-001 | 8020-SCP-332 | X-DI 32 04 |
710-679375-00 | 8020-SCP-323 | X-DI 32 03 |
710-678545-00 | 8020-SCP-322 | X-DI 32 02 |
710-678525-001 | 8020-SCP-321 | X-DI 32 01 |
本篇文章出自瑞昌明盛自動(dòng)化設(shè)備有限公司官網(wǎng),轉(zhuǎn)載請(qǐng)附上此鏈接:http://www.jiangxidcs