TEL Tokyo Electron 3381-000065-13基板PCB PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron 3381-000065-13 基板 PCB
類型：功能控制基板 / Interface or Logic PCB
制造商：Tokyo Electron Ltd.（TEL）
一、產(chǎn)品功能概述
該基板為 TEL 半導(dǎo)體設(shè)備內(nèi)部的一種專用電路板，通常用于：
信號(hào)中繼與分配：作為主控系統(tǒng)與下位執(zhí)行單元之間的橋接電路板
數(shù)據(jù)處理與邏輯控制：可能集成部分控制邏輯或信號(hào)處理功能
I/O 接口擴(kuò)展：提供外部接口，連接傳感器、驅(qū)動(dòng)器、閥控器等
電源管理：進(jìn)行局部電源轉(zhuǎn)換、濾波、保護(hù)等功能
?? 該 PCB 通常屬于設(shè)備中的“中間層”模塊，承擔(dān)設(shè)備某一特定子系統(tǒng)的功能接口任務(wù)。
二、典型應(yīng)用領(lǐng)域
1. CVD / ALD 系統(tǒng)控制部分
控制氣體比例閥、真空泵啟動(dòng)信號(hào)、熱板加熱器等
收集溫度、氣壓等傳感器信號(hào)，并進(jìn)行前置調(diào)理
2. Etch 系統(tǒng)的電源/接口子模塊
實(shí)現(xiàn) RF 功率模塊與工藝主控系統(tǒng)之間的信號(hào)橋接
管理射頻匹配網(wǎng)絡(luò)、功率開(kāi)關(guān)模塊
3. 晶圓搬運(yùn)平臺(tái)與 Loadlock 系統(tǒng)
控制真空門(mén)、升降臺(tái)、位移傳感器的輸入輸出通道
支持動(dòng)作順序控制、狀態(tài)回讀和動(dòng)作反饋
4. 清洗或烘干系統(tǒng)
控制泵、噴頭、化學(xué)供給系統(tǒng)等子模塊
實(shí)現(xiàn)液位、溫度、壓力的信號(hào)檢測(cè)與聯(lián)動(dòng)執(zhí)行
英文資料：
TEL Tokyo Electron 3381-0000065-13 PCB substrate
Type: Function Control Board/Interface or Logic PCB
Manufacturer: Tokyo Electron Ltd. (TEL)
1、 Product Function Overview
This substrate is a specialized circuit board inside TEL semiconductor equipment, typically used for:
Signal Relay and Distribution: As a bridge circuit board between the main control system and the lower level execution unit
Data processing and logic control: may integrate partial control logic or signal processing functions
I/O interface expansion: Provides external interfaces to connect sensors, drivers, valve controllers, etc
Power management: perform local power conversion, filtering, protection and other functions
?? This PCB usually belongs to the "middle layer" module in the device, responsible for the functional interface tasks of a specific subsystem of the device.
2、 Typical application areas
1. CVD/ALD system control part
Control gas proportional valve, vacuum pump start signal, hot plate heater, etc
Collect sensor signals such as temperature and air pressure, and perform pre conditioning
2. The power/interface submodule of the Etch system
Realize signal bridging between RF power module and process control system
Manage RF matching network and power switch module
3. Wafer handling platform and Loadlock system
Control the input and output channels of vacuum doors, lifting platforms, and displacement sensors
Support action sequence control, status feedback, and action feedback
4. Cleaning or drying system
Control sub modules such as pumps, nozzles, and chemical supply systems
Realize signal detection and linkage execution of liquid level, temperature, and pressure
2.產(chǎn) 品 展 示
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