TEL Tokyo Electron 381-6400994-2控制器模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron 381-6400994-2 控制器模塊 是一款應(yīng)用于 Tokyo Electron 半導(dǎo)體制造設(shè)備中的專用電子控制部件，廣泛集成于核心系統(tǒng)中，負責(zé)子系統(tǒng)的管理與協(xié)調(diào)。以下是該模塊的詳細介紹（無圖案）：
一、基本信息
產(chǎn)品型號：381-6400994-2
產(chǎn)品名稱：控制器模塊（Controller Module）
制造商：TEL（Tokyo Electron Limited）
用途分類：設(shè)備控制模塊 / 信號處理單元
所屬系統(tǒng)：適用于 TEL 的 CVD、Etch、Coater/Developer 等關(guān)鍵系統(tǒng)
二、主要功能與作用
| 功能類別 | 說明 |
|---|---|
| 設(shè)備控制核心 | 管理一個或多個執(zhí)行單元，如閥門、馬達、加熱器、傳感器等子系統(tǒng)的運行狀態(tài)與邏輯順序。 |
| 信號采集與傳輸 | 接收傳感器、編碼器等的輸入信號，并將處理結(jié)果傳送至主控系統(tǒng)。 |
| 狀態(tài)監(jiān)測與反饋 | 反饋當(dāng)前執(zhí)行情況（溫度、真空、氣壓、位置等）供上層判斷是否繼續(xù)操作。 |
| 接口橋接 | 實現(xiàn)上位機（主控板）與各執(zhí)行模塊之間的數(shù)字/模擬信號轉(zhuǎn)換與同步。 |
該模塊通常安裝在以下類型的 TEL 設(shè)備中：
CVD（化學(xué)氣相沉積）設(shè)備
控制沉積氣體流量、電源、溫度、真空腔體等。
Etcher（蝕刻設(shè)備）
管理 RF 功率輸出、等離子氣體流量、氣壓、腔體控制等。
Coater/Developer（涂膠顯影設(shè)備）
控制涂膠旋轉(zhuǎn)平臺、顯影泵送系統(tǒng)、加熱/冷卻單元等。
真空搬運系統(tǒng)
控制腔體門開閉、機械手臂移動、氣壓平衡等流程。
The TEL Tokyo Electron 381-6400994-2 controller module is a specialized electronic control component used in Tokyo Electron semiconductor manufacturing equipment, widely integrated into the core system, responsible for subsystem management and coordination. The following is a detailed introduction to the module (without patterns):
1、 Basic Information
Product model: 381-6400994-2
Product Name: Controller Module
Manufacturer: TEL (Tokyo Electron Limited)
Usage classification: Equipment control module/signal processing unit
System: Applicable to key systems such as CVD, Etch, Coater/Developer for TEL
2、 Main functions and functions
Function category description
The device control core manages the operational status and logical sequence of one or more execution units, such as valves, motors, heaters, sensors, and other subsystems.
Signal acquisition and transmission receive input signals from sensors, encoders, etc., and transmit the processing results to the main control system.
Status monitoring and feedback provide the current execution status (temperature, vacuum, air pressure, position, etc.) for the upper level to determine whether to continue the operation.
Interface bridging enables digital/analog signal conversion and synchronization between the upper computer (main control board) and various execution modules.
3、 Typical application areas
This module is typically installed in the following types of TEL devices:
CVD (Chemical Vapor Deposition) equipment
Control the flow rate of sedimentation gas, power supply, temperature, vacuum chamber, etc.
Etcher (etching equipment)
Manage RF power output, plasma gas flow rate, gas pressure, chamber control, etc.
Coater/Developer
Control the adhesive rotating platform, developing pump system, heating/cooling unit, etc.
Vacuum handling system
Control the process of opening and closing the chamber door, moving the robotic arm, and balancing the air pressure.
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
4.其他英文產(chǎn)品
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