TEL Tokyo Electron 2981-600550-11輸入輸出模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹:
中文資料:
一、基本信息
產(chǎn)品型號(hào):2981-600550-11
產(chǎn)品名稱:輸入輸出模塊(I/O Module)
制造商:TEL — Tokyo Electron Limited(東京電子)
模塊類別:數(shù)字/模擬輸入輸出板,常用于設(shè)備內(nèi)部信號(hào)控制系統(tǒng)
修訂版本:11(代表第11版,適用于特定硬件或固件版本)
二、主要功能
功能分類 | 功能描述 |
---|---|
數(shù)字輸入 | 接收外部信號(hào),如傳感器、按鈕、接近開(kāi)關(guān)等狀態(tài)反饋。 |
數(shù)字輸出 | 向設(shè)備執(zhí)行器發(fā)出開(kāi)/關(guān)控制信號(hào),如繼電器、電磁閥、燈光等。 |
模擬接口 | 可能支持部分模擬信號(hào)(如溫度、壓力、電壓等)的采集與輸出(若配置有模擬通道)。 |
信號(hào)中轉(zhuǎn)/隔離 | 實(shí)現(xiàn)上位控制系統(tǒng)與底層設(shè)備之間的電氣隔離和信號(hào)放大。 |
模塊間通信 | 與主控制板或PLC進(jìn)行高速數(shù)據(jù)交換,支持 TEL 專用通信協(xié)議。 |
三、典型應(yīng)用領(lǐng)域
該模塊廣泛應(yīng)用于 TEL 半導(dǎo)體設(shè)備的多個(gè)子系統(tǒng)中,主要包括:
涂膠顯影系統(tǒng)(Coater/Developer)
控制顯影泵、加熱臺(tái)、排氣風(fēng)扇、液體閥門(mén)、真空模塊等。
蝕刻系統(tǒng)(Etcher)
監(jiān)控腔體氣體狀態(tài),控制流量切換閥、高頻電源狀態(tài)、腔體門(mén)等。
CVD / ALD 薄膜沉積設(shè)備
管理溫控系統(tǒng)、真空壓力監(jiān)測(cè)、氣體切換、等離子體啟動(dòng)信號(hào)等。
搬運(yùn)與真空接口系統(tǒng)
用于檢測(cè)腔體門(mén)開(kāi)閉、升降平臺(tái)位置、機(jī)械臂狀態(tài)等信號(hào)反饋。
英文資料:
1、 Basic Information
Product model: 2981-600550-11
Product Name: I/O Module
Manufacturer: TEL - Tokyo Electron Limited
Module category: Digital/Analog Input/Output Board, commonly used for internal signal control systems of equipment
Revised version: 11 (representing the 11th edition, applicable to specific hardware or firmware versions)
2、 Main functions
Function Classification Function Description
Digital inputs receive external signals such as sensors, buttons, proximity switches, and other status feedback.
Digital output sends on/off control signals to device actuators, such as relays, solenoid valves, lights, etc.
The analog interface may support the acquisition and output of some analog signals (such as temperature, pressure, voltage, etc.) (if configured with analog channels).
Signal relay/isolation realizes electrical isolation and signal amplification between the upper control system and the underlying equipment.
High speed data exchange between modules and the main control board or PLC, supporting TEL dedicated communication protocol.
3、 Typical application areas
This module is widely used in multiple subsystems of TEL semiconductor equipment, mainly including:
Coater/Developer system
Control the developing pump, heating station, exhaust fan, liquid valve, vacuum module, etc.
Etcher system
Monitor the gas status of the chamber, control the flow switching valve, high-frequency power status, chamber door, etc.
CVD/ALD thin film deposition equipment
Manage temperature control system, vacuum pressure monitoring, gas switching, plasma start signal, etc.
Handling and Vacuum Interface System
Used to detect the opening and closing of the chamber door, the position of the lifting platform, the status of the robotic arm, and other signal feedback.
2.產(chǎn) 品 展 示
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