TEL Tokyo Electron 1D81-000096-13傳感器模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
一、基本信息
產(chǎn)品型號(hào)：1D81-000096-13
產(chǎn)品名稱：傳感器模塊（Sensor Module）
制造商：TEL（Tokyo Electron Limited，日本東京電子）
產(chǎn)品類型：信號(hào)采集/環(huán)境監(jiān)測(cè)模塊
版本編號(hào)：-13（表示第 13 個(gè)修訂版本或特定配置）
二、主要功能
該傳感器模塊一般用于 TEL 半導(dǎo)體制造設(shè)備中，承擔(dān)關(guān)鍵監(jiān)測(cè)與數(shù)據(jù)采集任務(wù)，主要功能如下：
| 功能類別 | 描述 |
|---|---|
| 信號(hào)采集 | 實(shí)時(shí)監(jiān)測(cè)溫度、壓力、位置、流量、氣體濃度或其他工藝參數(shù)。 |
| 數(shù)據(jù)傳輸 | 將采集的信號(hào)轉(zhuǎn)換為數(shù)字/模擬數(shù)據(jù)，傳送至主控制系統(tǒng)。 |
| 設(shè)備狀態(tài)反饋 | 檢測(cè)目標(biāo)狀態(tài)（如腔體真空、液位、閥門開閉等）并反饋給主控邏輯。 |
| 工藝監(jiān)控 | 用于過程參數(shù)穩(wěn)定控制，保障工藝重復(fù)性與一致性。 |
三、典型應(yīng)用領(lǐng)域
該模塊多用于以下 TEL 系統(tǒng)中，用于關(guān)鍵工藝狀態(tài)監(jiān)控：
CVD / ALD 薄膜沉積設(shè)備
監(jiān)測(cè)沉積室的溫度、壓力、氣體流速等。
Etch 蝕刻設(shè)備（如 Tactras 系列）
監(jiān)測(cè)等離子腔內(nèi)氣壓、RF 功率反射、冷卻水溫等參數(shù)。
光刻前處理設(shè)備（如 ACT 系列）
檢測(cè)加熱/冷卻板溫度、顯影壓力、噴淋量、氣體泄露等。
真空/搬運(yùn)模塊
檢測(cè)腔體開關(guān)狀態(tài)、夾持壓力、傳輸臂位置反饋等。
英文資料：
1、 Basic Information
Product Model: 1D81-000096-13
Product Name: Sensor Module
Manufacturer: TEL (Tokyo Electron Limited, Tokyo Electronics, Japan)
Product type: Signal acquisition/environmental monitoring module
Version number: -13 (indicating the 13th revision or specific configuration)
2、 Main functions
This sensor module is generally used in TEL semiconductor manufacturing equipment to undertake key monitoring and data acquisition tasks. Its main functions are as follows:
Functional category description
Real time monitoring of temperature, pressure, position, flow rate, gas concentration, or other process parameters through signal acquisition.
Data transmission converts the collected signals into digital/analog data and transmits them to the main control system.
The device status feedback detects the target status (such as chamber vacuum, liquid level, valve opening and closing, etc.) and feeds it back to the main control logic.
Process monitoring is used for stable control of process parameters, ensuring process repeatability and consistency.
3、 Typical application areas
This module is commonly used in the following TEL systems for monitoring critical process status:
CVD/ALD thin film deposition equipment
Monitor the temperature, pressure, gas flow rate, etc. of the sedimentation chamber.
Etch etching equipment (such as Tactras series)
Monitor parameters such as plasma chamber pressure, RF power reflection, and cooling water temperature.
Photolithography pre-processing equipment (such as ACT series)
Detect heating/cooling plate temperature, development pressure, spray volume, gas leakage, etc.
Vacuum/handling module
Detect the status of the chamber switch, clamping pressure, transmission arm position feedback, etc.
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