TEL Tokyo Electron 381-642664-1模擬輸入電子模塊PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
一、基本信息
產(chǎn)品型號：381-642664-1
產(chǎn)品名稱：模擬輸入電子模塊（Analog Input Electronic Module）
制造商：Tokyo Electron Limited（TEL，日本東京電子）
模塊類型：模擬信號采集輸入單元
修訂號：-1（表示該模塊的初始或第 1 版）
二、主要功能
該模塊主要用于采集來自現(xiàn)場設(shè)備的模擬信號輸入，為系統(tǒng)提供高精度參數(shù)輸入數(shù)據(jù)，用于控制、監(jiān)測與反饋。
| 功能類別 | 描述 |
|---|---|
| 模擬信號采集 | 接收 0–10V、4–20mA、RTD、熱電偶等類型的模擬信號 |
| 數(shù)據(jù)轉(zhuǎn)換 | 將模擬信號轉(zhuǎn)換為系統(tǒng)可識別的數(shù)字?jǐn)?shù)據(jù)（通常通過 ADC） |
| 工藝監(jiān)控 | 實時監(jiān)測溫度、壓力、流量、電壓、電流等物理量 |
| 信號隔離 | 具備電氣隔離功能，防止噪聲干擾及地環(huán)流影響系統(tǒng)穩(wěn)定性 |
| 通訊支持 | 與主控制器（PLC、工藝計算單元）進(jìn)行數(shù)據(jù)通信，實現(xiàn)控制閉環(huán) |
三、典型應(yīng)用場景
該模塊廣泛用于 TEL 半導(dǎo)體設(shè)備中的各種精密測量環(huán)節(jié)，常見用途包括：
光刻前后處理系統(tǒng)
采集加熱平臺溫度、液體流量、環(huán)境壓力等模擬量信號
CVD / PVD 薄膜沉積設(shè)備
監(jiān)控加熱腔體溫度、反應(yīng)氣體流量、冷卻系統(tǒng)溫差等
蝕刻設(shè)備
實時測量腔體內(nèi)溫度、電流、電壓、氣體密度等工藝參數(shù)
晶圓搬運系統(tǒng)
采集氣動元件壓力、電機反饋電流等參數(shù)，提升搬運精度和安全性
英文資料：
1、 Basic Information
Product model: 381-642664-1
Product Name: Analog Input Electronic Module
Manufacturer: Tokyo Electron Limited (TEL, Tokyo Electronics, Japan)
Module type: Analog signal acquisition input unit
Revision number: -1 (indicating the initial or first edition of this module)
2、 Main functions
This module is mainly used to collect analog signal inputs from field devices, providing high-precision parameter input data for the system for control, monitoring, and feedback.
Functional category description
Analog signal acquisition and reception of 0-10V, 4-20mA, RTD, thermocouple and other types of analog signals
Data conversion converts analog signals into system recognizable digital data (usually through ADC)
Real time monitoring of physical quantities such as temperature, pressure, flow rate, voltage, and current through process monitoring
Signal isolation has electrical isolation function to prevent noise interference and ground current from affecting system stability
Communication support enables data communication with the main controller (PLC, process computing unit) to achieve closed-loop control
3、 Typical application scenarios
This module is widely used in various precision measurement processes in TEL semiconductor equipment, with common applications including:
Photolithography pre-processing and post-processing system
Collect analog signals such as heating platform temperature, liquid flow rate, and environmental pressure
CVD/PVD thin film deposition equipment
Monitor heating chamber temperature, reaction gas flow rate, cooling system temperature difference, etc
Etching Equipment
Real time measurement of process parameters such as temperature, current, voltage, and gas density inside the cavity
Wafer handling system
Collect parameters such as pneumatic component pressure and motor feedback current to improve handling accuracy and safety
2.產(chǎn) 品 展 示
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