TEL Tokyo Electron 2180-020950-11控制主板模塊 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
一、基本信息
產(chǎn)品型號：2180-020950-11
產(chǎn)品名稱：控制主板模塊（Main Control Board Module）
制造商：Tokyo Electron Limited（TEL）
模塊類別：中央處理控制板 / 系統(tǒng)主控模塊
版本編號：-11（代表該主板的第 11 個版本修訂）
二、主要功能
該模塊是 TEL 設(shè)備中的核心控制組件之一，承擔(dān)整機(jī)工藝、動作流程和信號處理的主要任務(wù)。
| 功能分類 | 說明 |
|---|---|
| 中央控制功能 | 作為設(shè)備的“大腦”，執(zhí)行主程序、動作邏輯和設(shè)備狀態(tài)控制 |
| 接口管理 | 管理輸入輸出模塊、傳感器、驅(qū)動器、通信單元等子系統(tǒng)的交互 |
| 數(shù)據(jù)處理 | 實時處理采集數(shù)據(jù)，進(jìn)行計算、判斷和決策輸出 |
| 通訊橋接 | 支持 TEL 專用總線、RS232/485、CAN、Ethernet 等接口與上位機(jī)通訊 |
| 安全與聯(lián)鎖 | 處理安全互鎖、急停邏輯、故障診斷和日志記錄 |
三、典型應(yīng)用領(lǐng)域
該控制主板模塊廣泛應(yīng)用于以下 TEL 設(shè)備中作為主控平臺：
ACT 系列光刻輔助處理設(shè)備
例如 ACT8、ACT12、ACT18，用于控制涂膠、顯影、預(yù)烘后烘等工藝步驟
Tactras 系列蝕刻設(shè)備
控制腔體氣體流量、真空、RF 功率與溫控系統(tǒng)協(xié)調(diào)工作
Trias SPA / Trias TI 系列 CVD/ALD 沉積設(shè)備
進(jìn)行多步驟溫控、氣體混合、沉積時間序列的控制
Loadport、Transfer、EFEM 模塊
控制晶圓搬運路徑、機(jī)械臂位置與聯(lián)動保護(hù)邏輯
英文資料：
1、 Basic Information
Product model: 2180-020950-11
Product Name: Main Control Board Module
Manufacturer: Tokyo Electron Limited (TEL)
Module Category: Central Processing Control Board/System Main Control Module
Version number: -11 (representing the 11th revision of this motherboard)
2、 Main functions
This module is one of the core control components in TEL equipment, responsible for the main tasks of overall process, action flow, and signal processing.
Functional classification description
The central control function serves as the "brain" of the device, executing the main program, action logic, and device status control
Interface management manages the interaction between subsystems such as input/output modules, sensors, drivers, and communication units
Real time processing of collected data for calculation, judgment, and decision output
Communication bridging supports communication between TEL dedicated bus, RS232/485, CAN, Ethernet and other interfaces with the upper computer
Safety and Interlocking Handling: Safety Interlocking, Emergency Stop Logic, Fault Diagnosis, and Logging
3、 Typical application areas
This control motherboard module is widely used as the main control platform in the following TEL devices:
ACT series lithography auxiliary processing equipment
For example, ACT8, ACT12, ACT18 are used to control the process steps of gluing, developing, pre drying, and post drying
Tactras series etching equipment
Coordinate the control of chamber gas flow rate, vacuum, RF power, and temperature control system
Trias SPA/Trias TI series CVD/ALD deposition equipment
Perform multi-step temperature control, gas mixing, and sedimentation time series control
Loadport, Transfer, EFEM modules
Control wafer handling path, robotic arm position, and linkage protection logic
2.產(chǎn) 品 展 示
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