TEL Tokyo Electron BX80-000063-V1控制器機(jī)架 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
一、基本信息
產(chǎn)品型號(hào)：BX80-000063-V1
產(chǎn)品名稱：控制器機(jī)架（Controller Rack / 控制架）
制造商：Tokyo Electron Limited（TEL，日本東京電子）
版本編號(hào)：V1（表示版本 1 或第一代結(jié)構(gòu)版本）
二、產(chǎn)品定義與作用
該機(jī)架是 TEL 設(shè)備中用于安裝、連接和整合多個(gè)控制模塊、電路板、供電單元與通信接口的標(biāo)準(zhǔn)框架結(jié)構(gòu)部件，是整個(gè)控制系統(tǒng)的物理與電氣“骨架”。
| 功能類別 | 描述 |
|---|---|
| 模塊安裝平臺(tái) | 提供標(biāo)準(zhǔn)卡槽或托架，支持安裝控制板、I/O 模塊、電源模塊等 |
| 電源分配 | 內(nèi)部可能集成背板電源總線，為各模塊分配穩(wěn)定供電 |
| 信號(hào)背板支持 | 提供多通道信號(hào)總線或連接插槽，實(shí)現(xiàn)模塊間通信連接 |
| 結(jié)構(gòu)支撐 | 確保電路板模塊牢固固定于設(shè)備中，抗振防松 |
| 散熱與屏蔽 | 配合風(fēng)道、導(dǎo)熱片或金屬外殼，確保運(yùn)行溫度與EMI屏蔽性能 |
三、典型應(yīng)用場(chǎng)景
該機(jī)架通常應(yīng)用于以下類型的 TEL 半導(dǎo)體設(shè)備控制系統(tǒng)中：
ACT 系列（光刻輔助處理設(shè)備）
Trias、Tactras 系列（CVD / Etch 設(shè)備）
晶圓搬運(yùn)系統(tǒng)（EFEM、Load Port、Transfer Module）
在上述設(shè)備中，該機(jī)架用于整合：
主控制板（如 CPU 板、I/O 板）
通信模塊（如 RS-232/422/485、Ethernet、TEL bus）
數(shù)字與模擬接口板
電源模塊（AC/DC、24V 電源等）
英文資料：
1、 Basic Information
Product model: BX80-000063-V1
Product Name: Controller Rack
Manufacturer: Tokyo Electron Limited (TEL, Tokyo Electronics, Japan)
Version number: V1 (representing version 1 or first generation structural version)
2、 Product Definition and Function
This rack is a standard framework structural component used in TEL equipment for installing, connecting, and integrating multiple control modules, circuit boards, power supply units, and communication interfaces. It is the physical and electrical "skeleton" of the entire control system.
Functional category description
The module installation platform provides standard card slots or brackets, supporting the installation of control boards, I/O modules, power modules, etc
The internal power distribution may integrate a backplane power bus to provide stable power supply for each module
The signal backplane supports providing multi-channel signal buses or connection slots to achieve communication connections between modules
Structural support ensures that the circuit board module is firmly fixed in the equipment, anti vibration and anti loosening
Heat dissipation and shielding are combined with air ducts, thermal conductive sheets, or metal shells to ensure operating temperature and EMI shielding performance
3、 Typical application scenarios
This rack is typically used in TEL semiconductor equipment control systems of the following types:
ACT series (photolithography auxiliary processing equipment)
Trias, Tactras series (CVD/Etch equipment)
Wafer Handling System (EFEM, Load Port, Transfer Module)
In the above equipment, this rack is used for integrating:
Main control board (such as CPU board, I/O board)
Communication modules (such as RS-232/422/485, Ethernet, TEL bus)
Digital and Analog Interface Board
Power module (AC/DC, 24V power supply, etc.)
2.產(chǎn) 品 展 示
3.其他產(chǎn)品
IS200DTAIH1ABB雙系統(tǒng)監(jiān)測(cè)模塊
4.其他英文產(chǎn)品
REXROTH PPC-R22.1N-T-NN-P1-NN-FW servo
DELTA TAU ACC-24E2 interface simulation
ALSTOM 3EST125-975 DCC2382A Control Pane
| STC3720-4085-56C | SC403-013-T4 | SC90200101NNN |
| SRF5570-4986-84-5-82BC-CU | SC403-001-T1 | SC933-NN-001-01 |
| SRF5570-4483-84-82BC | SC402-001-T4 | SC756B-001-01 |
| SRF5360-4985-84-5-82BC-CU | SC402-048-T4 | SC905-001-01 |
| SRF5348-4485-84-5-45BC-CU | SC402-001-T5 | SC903-024-01 |
| SRF5348-4485-84-45BC-CU | SC402D23T4 | SC902NN-001-01 |
本篇文章出自瑞昌明盛自動(dòng)化設(shè)備有限公司官網(wǎng)，轉(zhuǎn)載請(qǐng)附上此鏈接:http://www.jiangxidcs
