TEL Tokyo Electron 1B80-002391-11控制主板卡件 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
TEL Tokyo Electron 1B80-002391-11 控制主板卡件（Control Main Board） 是一塊核心控制類印刷電路板，主要用于TEL半導(dǎo)體制造設(shè)備中承擔(dān)系統(tǒng)級(jí)的邏輯控制、信號(hào)調(diào)度、子模塊協(xié)調(diào)與工藝流程管理等任務(wù)。它是設(shè)備內(nèi)部多個(gè)子系統(tǒng)之間的中樞“主控模塊”，在系統(tǒng)的整體運(yùn)行中處于關(guān)鍵地位。
一、基本信息
產(chǎn)品名稱：控制主板卡件 / 主控板
產(chǎn)品型號(hào)：1B80-002391-11
制造商：Tokyo Electron Ltd.（TEL）
功能分類：系統(tǒng)級(jí)邏輯控制、子系統(tǒng)調(diào)度控制
典型位置：安裝于主控電氣柜、機(jī)架內(nèi)部或控制接口單元中
二、主要功能
設(shè)備主控制邏輯執(zhí)行
管理設(shè)備開機(jī)初始化、工藝流程邏輯、關(guān)機(jī)次序等；
實(shí)現(xiàn)對(duì)各子模塊（氣路、閥控、電源、搬運(yùn)等）的協(xié)調(diào)控制。
接口管理
集成多個(gè)通信接口（I/O 總線、串口、CAN、Ethernet等），用于連接 I/O 板卡、傳感器、驅(qū)動(dòng)單元。
數(shù)據(jù)采集與處理
處理來自傳感器板、輸入卡件等的反饋數(shù)據(jù)，實(shí)時(shí)響應(yīng)控制策略。
與上位系統(tǒng)通信
與主機(jī)或工程站通信，支持配方下載、參數(shù)調(diào)整、日志上傳等功能。
三、應(yīng)用設(shè)備類型（部分）
該主控板卡可部署于以下TEL設(shè)備類型中：
Etcher（干法刻蝕設(shè)備）
控制真空泵、等離子源、氣體混合模塊等核心功能。
CVD/ALD設(shè)備
管理溫控區(qū)、化學(xué)源供給、反應(yīng)腔操作等子系統(tǒng)。
Coater/Developer（光刻顯影設(shè)備）
協(xié)調(diào)晶圓搬送、旋轉(zhuǎn)、顯影、加熱等功能單元。
Transfer Robot系統(tǒng)
統(tǒng)一控制機(jī)械臂運(yùn)動(dòng)軌跡、限位反饋與手爪動(dòng)作等。
英文資料：
The TEL Tokyo Electron 1B80-002391-11 Control Main Board is a core control printed circuit board mainly used in TEL semiconductor manufacturing equipment to undertake system level logic control, signal scheduling, submodule coordination, and process flow management tasks. It is the central "control module" between multiple subsystems within the device, playing a critical role in the overall operation of the system.
1、 Basic Information
Product Name: Control Motherboard Card/Main Control Board
Product model: 1B80-002391-11
Manufacturer: Tokyo Electron Ltd. (TEL)
Functional classification: System level logic control, subsystem scheduling control
Typical location: Installed inside the main control electrical cabinet, rack, or control interface unit
2、 Main functions
Execution of equipment main control logic
Manage device startup initialization, process logic, shutdown sequence, etc;
Realize coordinated control of various sub modules (gas circuit, valve control, power supply, handling, etc.).
Interfaces
Integrate multiple communication interfaces (I/O bus, serial port, CAN, Ethernet, etc.) for connecting I/O boards, sensors, and driver units.
data acquisition and processing
Process feedback data from sensor boards, input cards, etc., and respond in real-time to control strategies.
Communicate with the upper system
Communicate with the host or engineering station, support formula download, parameter adjustment, log upload and other functions.
3、 Application device type (partial)
This controller card can be deployed in the following TEL device types:
Etcher (dry etching equipment)
Control core functions such as vacuum pump, plasma source, gas mixing module, etc.
CVD/ALD equipment
Manage subsystems such as temperature control zone, chemical source supply, and reaction chamber operation.
Coater/Developer (Photolithography and Development Equipment)
Coordinate wafer handling, rotation, development, heating and other functional units.
Transfer Robot System
Unified control of robotic arm motion trajectory, limit feedback, and claw movements.
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